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TA4500F
TOSHIBA Bipolar Linear Integrated Circuit SiGe Monolithic
TA4500F
1.9 GHz Band RX Front-End IC PHS, Digital Cordless Telecommunication Applications
Features
* * * * * * * Low-noise amplifier / down-conversion mixer Integrated local buffer amplifier Single positive power supply: VCC = 3.0 V Large conversion gain: GLNA = 17.5 dB (typ.) GMIX = 5.0 dB (typ.) High input IP3: IIP3LNA = -7.5 dBmW (typ.) IIP3MIX = 7.0 dBmW (typ.) High 1/2 IF reduction ratio: 1/2IFRMIX = 45 dB (typ.) Small package: QS16 (2.5 mm x 2.5 mm x 0.55 mm) QS16 Weight: 0.0065 g (typ.)
Absolute Maximum Ratings (Ta = 25C)
Characteristic Supply voltage Symbol VCC (Note 1) PIN (RF_IN) Input power PIN (LO_IN) PIN (MIX_IN) Power dissipation Operating temperature range Storage temperature range Pd (Note 2) Topr Tstg Rating 4.5 10 0 0 500 -40 to +85 -55 to +150 Unit V dBmW dBmW dBmW mW C C
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: VCC = VCC1 = VCC2 = VCC3 Note 2: When mounted on a 30 mm x 35 mm x 0.6 mm FR4 substrate at Ta = 25C (double-sided substrate: the reverse side is ground connection)
Caution
This device is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer.
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Electrical Characteristics
VCC = 3.0 V, Ta = 25C, Zg = Zl = 50
Characteristic Symbol Test Condition Min Typ Max Unit
Total
Operating frequency Operating supply voltage Supply current f VCC ICC pRF_IN = pLO_IN = pMIX_IN = 0 mW (no signal) 1.884 2.7 3.0 15.0 1.920 3.3 22.0 GHz V mA
Low Noise Amplifier (LNA) Block
Power gain Noise figure Input IP3 GLNA NFLNA IIP3LNA fRF_IN = 1.9 GHz, pRF_IN = -35 dBmW Measured at 1.9 GHz (Note 3) 15.0 -13.5 17.5 2.2 -7.5 22.0 3.0 dB dB dBmW
Down Conversion Mixer (MIX) Block
Conversion gain GMIX fMIX_IN = 1.9 GHz, pMIX_IN = -25 dBmW, fLO_IN = 1.66 GHz, pLO_IN = -15 dBmW, measured at IF_OUT1, IF_OUT2 terminated via 50 and vice versa fLO_IN = 1.66 GHz, pLO_IN = -15 dBmW, measured at IF_OUT1, IF_OUT2 terminated via 50 and vice versa, fIF_OUT = 240 MHz, DSB (Note 4) fLO_IN = 1.66 GHz, pLO_IN = -15 dBmW, measured at IF_OUT1, IF_OUT2 terminated via 50 and vice versa (Note 5) fMIX_IN = 1.9 GHz, 1.78 GHz, pMIX_IN = -25 dBmW, fLO_IN = 1.66 GHz, pLO_IN = -15 dBmW, measured at IF_OUT1, IF_OUT2 terminated via 50 and vice versa, fIF_OUT = 240 MHz fLO_IN = 1.66 GHz, pLO_IN = -15 dBmW, measured at MIX_IN, IF_OUT1, 2 terminated via 50 2.8 5.0 7.0 dB
Noise figure
NFMIX
13.0
17.5
dB
Input IP3
IIP3MIX
-1.0
7.0
dBmW
1/2 IF reduction ratio
1/2IFRMIX
45.0
dB
Local leak power
PLK
-40.0
dBmW
Note 3: Note 4:
IIP3 of the LNA block is converted from IM3 when RF1 = 1.900 GHz / -35 dBmW, RF2 = 1.9006 GHz / -35 dBmW are input to RF_IN. Measured with the high pass filter shown below connected to MIX_IN.
2.4 pF 12 nH
2.4 pF 4.7 nH 12 nH
-0.8 dB
2
|S21|
10 dB / 100 MHz
850 MHz Frequency
Note 5: Note 6:
IIP3 of the MIX block is converted from IM3 when RF1 = 1.900 GHz / -25 dBmW, RF2 = 1.9006 GHz / -25 dBmW are input to MIX_IN. All tests for electrical characteristics are performed using the test board shown on page 4.
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Block Diagram and Marking (Top View)
12
9
12
9 Product marking
13
8
13
8
MD
16 5 16 5 Monthly dot marking 1 4 1 4 Year dot marking Pin 1 marking
Pin Configuration
Pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin name N.C. LO_term LO_IN GND1 GND2 VCC2 IF_OUT2 IF_OUT1 MIX_IN VCC1 LNA_ind LNA_OUT GND3 RF_IN GND4 VCC3 Description Not connected to the pellet. Connect to ground. MIX local input termination pin. To be terminated. MIX local input Ground. Ground. Supply pin for MIX. MIX IF output. Biasing circuit is necessary. MIX IF output. Biasing circuit is necessary. MIX RF input. Supply pin for LNA and biasing circuits. LNA emitter. Connect to ground via 1 nH inductance // 1 pF capacitance. LNA output. Biasing circuit is necessary. Ground. LNA input. Ground. Supply pin for MIX.
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Circuit Diagram of Test Board
LNA_OUT, f=1.9GHz C13 C14 C12 L7 L8 L9 C5 C11 L6 VCC=3.0V C4 C3 L3 C8 RF_IN, f=1.9GHz VCC=3.0V C6 R1 L1 LO_IN, f=1.66GHz C1 C2 C15 L10 C7 L2 L4 C9 C10 L5 IF_OUT1, f=240MHz IF_OUT2, f=240MHz MIX_IN, f=1.9GHz
VCC=3.0V
List of External Chip Components
Part C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 R1 Value 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 5 pF 5 pF 39 pF 1 pF 82 pF 1.2 pF 3 pF 8.2 nH 120 nH 120 nH 120 nH 120 nH 8.2 nH 1 nH 10 nH 15 nH 6.8 nH 51 Chip Series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series MCR01 series MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA ROHM Decoupling capacitor Decoupling capacitor Decoupling capacitor Decoupling capacitor Decoupling capacitor Decoupling capacitor DC blocking capacitor DC blocking capacitor IF_OUT matching IF_OUT matching MIX_IN matching Determining LNA gain LNA_OUT matching LNA_OUT matching RF_IN matching LO_IN matching MIX output load MIX output load IF_OUT matching IF_OUT matching MIX_IN matching Determining LNA gain LNA_OUT matching LNA output load LNA_IN matching LO termination load Description
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Typical Operating Characteristics of Low-Noise Amplifier Block
LNA Block POUT(1-,2-tone),PIM3 vs PIN
VCC = 3 V, Ta = 25 C, RF1 = 1.9000 GHz, RF2 = 1.9006 GHz for 2-tone, IM3 measurement 20 0 POUT (1-tone) -20 POUT (2-tone) -40 -60 -80 -100 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 PIM3 POUT(1-tone) [dBmW] POUT(2-tone) [dBmW] PIM3 [dBmW])
POUT(dBmW)
PIN (dBmW)
LNA Block GLNA, IIP3LNA, NFLNA vs Temperature
VCC = 3 V, RF1 = 1.9000 GHz/-35 dBmW, RF2 = 1.9006 GHz/-35 dBmW for IIP3 measurement 16.8 16.6 16.4 16.2 16.0 GLNA 3 2.5 2.25 2 NFLNA 1.75 1.5 -7.2 1.25 -7.5 IIP3LNA 1 -7.8 IIP3 (dBmW) 0.75 -8.1 0.5 -8.4 0.25 -8.7 -60 -40 -20 0 20 40 60 80 0 100 -9.0 GLNA [dB] NFLNA [dB] IIP3LNA [dBmW]) NF (dB)
NF (dB) -7.5 IIP3 (dBmW)
2.75
Gain (dB)
15.8 15.6 15.4 15.2 15.0 14.8 14.6 14.4
Ta (C)
LNA Block GLNA, IIP3LNA, NFLNA vs VCC
Ta = 25 C, RF1 = 1.9000 GHz/-35 dBmW, RF2 = 1.9006 GHz/-35 dBmW for IIP3 measurement 16.60 16.55 16.50 16.45 16.40 NFLNA GLNA 3 2.75 2.5 2.25 2 1.75 1.5 -7.3 IIP3LNA 1.25 -7.4 1 0.75 -7.6 0.5 -7.7 0.25 -7.8 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -7.9
Gain (dB)
16.35 16.30 16.25 16.20 16.15 16.10 16.05 16.00
GLNA [dB] NFLNA [dB] IIP3LNA [dBmW])
VCC (V)
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Typical Operating Characteristics of Down Conversion Mixer Block
MIX Block POUT(1-,2-tone),PIM3 , P1/2IF vs PIN
VCC = 3 V,Ta = 25 C, LO = 1.66 GHz/-15dBmW, RF1 = 1.9000 GHz, 1.7800 GHz, RF2 = 1.9006 GHz for 2-tone, IM3 measurement 0 -10 -20 -30 POUT (2-tone) POUT (1-tone)
POUT(dBmW)
-40 -50 -60 -70 -80 -90 -100 -40 -35 -30 -25 -20 -15 -10 -5 0 P1/2IF PIM3 POUT(1-tone) [dBmW] POUT(2-tone) [dBmW] PIM3 [dBmW]) P1/2IF [dBmW]
PIN (dBmW)
MIX Block GMIX, IIP3MIX, NFMIX vs Temperature
VCC = 3 V, LO = 1.66 GHz/-15 dBmW, RF1 = 1.9000 GHz/-25 dBmW, RF2 = 1.9006 GHz/-25 dBmW for IIP3 measurement 6.4 6.1 5.8 5.5 5.2 GMIX NFMIX 15 13 12 11 10 9 8 IIP3MIX 7 6 5 4 -60 -40 -20 0 20 40 60 80 3 100 8.0 7.5 7.0 6.5 6.0 5.5 5.0 IIP3 (dBmW) GMIX [dB] NFMIX [dB] IIP3MIX [dBmW]) NF (dB)
8.0 7.5 7.0 6.5 6.0 5.5 5.0 IIP3 (dBmW) NF (dB)
14
Gain (dB)
4.9 4.6 4.3 4.0 3.7 3.4 3.1 2.8
Ta (C)
MIX Block GMIX, IIP3MIX, NFMIX vs VCC
Ta = 25 C, LO = 1.66 GHz/-15 dBmW, RF1 = 1.9000 GHz/-25 dBmW, RF2 = 1.9006 GHz/-25 dBmW for IIP3 measurement 4.94 4.92 4.90 4.88 4.86 NFMIX 15 14 13 12 11 GMIX 10 9 8 IIP3MIX 7 6 5 4 3 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Gain (dB)
4.84 4.82 4.80 4.78 4.76 4.74 4.72 4.70
GMIX [dB] NFMIX [dB] IIP3MIX [dBmW])
VCC (V)
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Typical Operating Characteristics of Down Conversion Mixer Block (continued)
MIX Block GMIX, IIP3MIX, NFMIX vs Local Input Power
VCC = 3 V, Ta = 25 C, RF1 = 1.9000 GHz/-25 dBmW, RF2 = 1.9006 GHz/-25 dBmW for IIP3 measurement 6.0 5.7 5.4 5.1 4.8 NFMIX 15 13 12 11 GMIX 10 9 8 IIP3MIX 7 6 5 4 3 -24 -21 -18 -15 -12 -9 -6 8.0 7.5 7.0 6.5 6.0 5.5 5.0 IIP3 (dBmW) GMIX [dB] NFMIX [dB] IIP3MIX [dBmW]) NF (dB) 14
Gain (dB)
4.5 4.2 3.9 3.6 3.3 3.0 2.7 2.4
PLO (dBmW)
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Circuit Diagram of Evaluation Board
C8 C9 L8 L7 L6 C7 L5 C3 C6 C10 L9 L2 C5 L3 VCC=3.0V C4 C1 C2 R1
1 2 3 6 5 4
L4 VCC=3.0V IF_OUT L10 f=243.95MHz C11
RF_IN f=1.9GHz VCC=3.0V
U1
L1 LO_IN f=1.65605GHz
List of External Chip Components on Evaluation Board
Part C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 L1 Value 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1 pF 2 pF 1 pF 3 pF 2.7 pF 8.2 nH Chip Series GRM15 series MURATA GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series GRM15 series LQG15HN series MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA Part L2 L3 L4 L5 L6 L7 L8 L9 L10 R1 U1 Value 120 nH 120 nH 5.6 nH 2.2 nH 3.3 nH 5.6 nH 1 nH 6.8 nH 100 nH 1.2 k 243.95 MHz Chip Series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series LQG15HN series MCR01 series MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA ROHM MURATA
SAFDA243MRD9X00R00
Typical Electrical Characteristics of Evaluation Board (for Reference Only)
VCC = 3.0 V, Ta = 25C, Zg = Zl = 50 , fLO_IN = 1.65605 GHz, pLO_IN = -15 dBmW, fIF_OUT = 243.95 MHz
Characteristic Conversion gain Noise figure 3 order intermodulation distortion Image reduction ratio 1/2 IF reduction ratio
rd
Symbol GC NF IM3 IMR 1/2IFR
Test Condition fRF_IN = 1.9 GHz, pRF_IN = -30 dBmW (Note 7) DSB IF output: fRF_IN = 1.9 GHz, pRF_IN = -46 dBmW, rd 3 order: fRF_IN1 = 1.8994 GHz, fRF_IN2 = 1.8988 GHz, pRF_IN1 = pRF_IN2 = -46 dBmW fRF_IN = 1.9 GHz,1.4121 GHz, pRF_IN = -46 dBmW fRF_IN = 1.9 GHz,1.778025 GHz, pRF_IN = -46 dBmW
Typ 17.5 3.8 64.0 27.0 48.0
Unit dB dB dB dB dB
Note 7: Conversion gain in the above table includes the insertion loss (3.5 dB typical) of SAW filter, SAFDA243MRD 9X00R00.
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Typical Operating Characteristics of Evaluation Board
TA4500F on Application Board POUT,PIM3 vs PIN
VCC = 3 V, Ta = 25 C LO = 1.65605 GHz/-15dBmW, RF1 = 1.9000 GHz for POUT measurement, RF1 = 1.9006 GHz, RF2 = 1.9012 GHz for upper channel IM3 measurement, RF1 = 1.8994 GHz, RF2 = 1.8988 GHz for low er channel IM3 measurement 0 -10 -20 -30 POUT
POUT(dBmW)
-40 -50 -60 -70 -80 -90 -100 -50 -45 -40
PIM3(up) PIM3(low )
POUT [dBmW] PIM3(up) [dBmW]) PIM3(low ) [dBmW] -35 -30 -25 -20
PIN (dBmW)
Pattern Layout of Evaluation Board (Top Layer)
5.6nH 1pF 1000pF 2.2nH 0 2pF 5.6nH 1000pF 120nH 3.3nH 3pF 1nH 1pF 6.8nH 1000pF 120nH 1000pF 0 8.2nH 1000pF 1000pF 1.2k 1000pF 1000pF 2.7pF
100H
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Notice
The circuits and measurements contained in this document are given in the context of example applications of the product only. Moreover, these example application circuits are not intended for mass production since the high-frequency characteristics (i.e., the AC characteristics) of the device will be affected by the external components that the customer uses, by the design of the circuit and by various other conditions. It is the responsibility of the customer to design external circuits that correctly implement the intended application and to check the characteristics of the design. TOSHIBA assumes no responsibility for the integrity of customer circuit designs or applications.
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Package Physical Dimensions
QS16
Unit: mm
Weight: 0.0065 g (typ.)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN GENERAL
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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